According to reports from Tom's Hardware, Laks Pappu, a senior researcher and chief architect of SoC of AMD, a large semiconductor manufacturer, revealed on LinkedIn that AMD is developing GPUs with 2.5D / 3.5D chiplet architecture packaging, which represents a promise to return to the high-performance GPU market.

AMD's current Radeon RX 9000 series cards that use RDNA 4 architecture have not challenged NVIDIA (NVIDIA) in the high-desktop GPU market. The reason is that the performance of the flagship RX 9070 XT is roughly equivalent to the GeForce RTX 5070 Ti in NVIDIA. But the latest situation shows that the company is preparing technical energy for the next generation of flagship products.

Laks Pappu is responsible for the research and development of AMD Data Center GPUs and the planning domain Radeon architecture. In a recent LinkedIn dynamic, the two generations of Navi4x and Navi5x were further revealed. Laks Pappu mentioned in a personal introduction that its work includes creating the next generation of competitive GPUs with 2.5D/3.5D chiplet architecture packages.

2.5D / 3.5D chiplet architecture packaging GPU helps improve chip connection bandwidth and energy efficiency. The products are suitable for high-performance computing and data center markets. It represents AMD's research on two architectures, multi-chip and single-chip architectures, to meet market demands in different performance and cost areas.

Although AMD has not published the time or model, it is reported that it may return to high-performance GPU competition signals. The development of multi-chip packaging may help AMD maintain cost control while improving the performance of data processing and graphics rendering products.